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| 文章出处：网友投稿 发布时间：2005-10-11 |
和申请材料一起寄出信件
Beijing University
Beijing,100084
P.R. CHINA
October 22, 1997
Dear Sir/Madam:
I wish to apply for and financial aids to your Graduate School to pursue a Master’s degree in Materials Science and Engineering. My intended date of entry is Fall, 1998.
Enclosed please find: (1) A completed application form and application fee; (2) Official transcripts from Beijing University; (3) RESUME and PURPOSE STATEMENT; (4) Letters of recommendation. Furthermore, I have requested the reference, I am enclosing photocopies of my TOEFL and GRE scores.
Thank you very much in advance for you immediate action to process my application.
Sincerely yours.
和申请材料一起寄出的Cover Letter
Annie Wang
P.O. Box 8740
Beijing 100084
P.R. CHINA
October 22, 2001
Dear Sir / Madam:
I am applying for acceptance and financial aid in a bid to pursue a Master’s Degree in Materials Science and Engineering at your university. My intended date of enrollment is the beginning of September 2002.
Enclosed hereinwith are: (1) a completed application form; (2) the application fee by way of an in
ternational money order; (3) a copy of my resume, and (4) my personal statement.
The Beijing University, my alma mater, will send official transcripts of my undergraduate academic record to you soon. Meanwhile, I have arranged for you to receive three letters of recommendation directly from their authors, two my former professors and the other my current employer.
I trust that you have received my official TOEFL and GRE scores from the ETS. In any case, photocopies of my TOEFL and GRE score reports are included in this package for your reference.
I will be looking forward to hearing of your decision regarding my application. If you need any other information or material, please let me know promptly.
Sincerely yours
Annie Wang
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